Wireless LAN/PAN Chipset Bundle
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Includes three
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Synopsis:
This purchase option
will give you a 35% discount off the combined price of three different
reports that will provide you with in-depth market data and analysis on
both the exciting wireless LAN and wireless PAN chipset markets.
The reports included in this bundled option are:
Report
1: Wi-Fi Chipset Market: Which Innovations Will Prevail?
Published: March 2003, updated April 2003
Analysts: Mareca
Hatler and Jeff Kreegar
Pages: 53
This report is the product of more than two years and over 100 hours of research and analysis from multiple industry and web based sources, this report describes and explains the major market forces, technology innovations and strategies that have driven the wildly successful wireless lan (Wi-Fi) chipset market.
It addresses questions
such as:
Who are the market leaders and how are they positioning themselves for
the next market's next phase? What are the most interesting technologies
for today?
Will 802.11g replace 802.11b and is 802.11a going to be skipped in favor
of "g"?
This report also covers the latest technology issues such as chipset design tradeoffs and testing challenges as well as where are today in terms of dealing with security concerns and the lack of multimedia and quality of service.
In addition, this report presents updated information and analysis on 15 companies, both startups and established chipmakers, while providing insight on the opportunities and potential threats in this rapidly moving market.
Full
Synopsis & Table of Contents
Report
2: Bluetooth Chipset Market: Traditional Chipmakers Emerge
Published:
March 2003
Analysts: Mareca
Hatler and Jeff Kreegar
Pages: 33
With Bluetooth finally here to stay, the competitive landscape is currently undergoing dramatic change. This report is the product of more than two years and 100 hours of researching and analyzing the wireless PAN market that focuses on technology considerations, market outlook and major competitive threats specifically for the Bluetooth market.
The first section covers the leading analysts' perspectives on major trends, challenges, applications, development phases and market size today and future projections.
The second section is detailed technology background that covers the trade-offs of various chip development approaches, chipset design and testing challenges as well what the upcoming Bluetooth 2.0 specification covers and what it means for developers.
The third section is a detailed competitive landscape that covers 13 of the major Bluetooth companies, both private and public. This section includes a competitive analysis on which traditional chipmakers or startups will challenge the current market leader, Cambridge Silicon Radio (CSR), with more than 60 percent of the market. Last, we cover each company's overview, products, customers/partners, financials/funding, business model evolution and as well as our aggregated analysis of each company's viability in this rapidly moving market.
Full
Synopsis & Table of Contents
Report 3: Ultra Wideband: Poised to Transform the Wireless Industry
Published:
Nov. 2003
Analysts: Mareca
Hatler and Mike Ritter, PhD
Pages: 101
Based on dozens of interviews with executives at UWB focused companies, UWB stakeholders at Fortune1000 companies and hundreds of hours of research on existing target markets, this report provides emerging market intelligence on the following areas:
- Market size projections
and segmentation on initial mass markets
- Projections and analyses on niche and future potential markets
- Analysis on the current in-progress standardization situation for 15.3a and 15.4a
- In-depth coverage of the leading startups and established companies that are leading the charge toward commercialization
- In-depth Technology Background that includes a comparison of singleband to multiband schemes as well as UWB compared with other wireless technologies
- Input on what chipset characteristics will have the best chance of attracting an acquirer